Invention Grant
- Patent Title: Assembly-based parametric modeler
- Patent Title (中): 基于装配的参数建模器
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Application No.: US12556494Application Date: 2009-09-09
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Publication No.: US08463581B2Publication Date: 2013-06-11
- Inventor: David J. Corcoran , Heung-Wing Li
- Applicant: David J. Corcoran , Heung-Wing Li
- Applicant Address: US CA San Rafael
- Assignee: Autodesk, Inc.
- Current Assignee: Autodesk, Inc.
- Current Assignee Address: US CA San Rafael
- Agency: Fish & Richardson P.C.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Presently disclosed is a process and system for assembly-based parametric modeling having a single design environment in which the parts, components, and assemblies thereof may be designed concurrently. In embodiments of the present invention, every assembly has a deterministic parametric history supporting both top-down and bottom-up assembly design methodologies. Top-down components may be built in place, reducing the user interaction required to define the attachment and movement characteristics of the assembly. Bottom-up components may be inserted into an assembly using a parametric Insert Component Feature. The process and system also provides the ability to parametrically define the shape of an assembly in multiple orientations that still regenerate deterministically.
Public/Granted literature
- US20100060635A1 ASSEMBLY-BASED PARAMETRIC MODELER Public/Granted day:2010-03-11
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