A translating memory module is disclosed including a printed circuit board, at least one memory integrated circuit coupled to the printed board, and at least one support chip coupled to the printed circuit board and coupled between the edge connector and the at least one memory integrated circuit. The at least one support chip includes a bi-directional translator to translate between a first memory communication protocol for the at least one memory integrated circuit and a second memory communication protocol for a memory channel differing from the first memory communication protocol. The second memory communication protocol to communicate data, address, and control signals over the memory channel bus to read and write data into the memory of the translating memory module.