Invention Grant
- Patent Title: Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
- Patent Title (中): 导热组合物，散热板，散热基板和使用导热组合物的电路模块，以及制作导热组合物的方法
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Application No.: US13146666Application Date: 2010-02-23
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Publication No.: US08465666B2Publication Date: 2013-06-18
- Inventor: Toshiyuki Asahi , Yukihiro Shimasaki , Koji Shimoyama
- Applicant: Toshiyuki Asahi , Yukihiro Shimasaki , Koji Shimoyama
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2009-041964 20090225; JP2009-286123 20091217; JP2010-008760 20100119
- International Application: PCT/JP2010/001171 WO 20100223
- International Announcement: WO2010/098066 WO 20100902
- Main IPC: C09K5/08
- IPC: C09K5/08 ; C08K3/10 ; C08K3/14 ; C08L63/00 ; H01L23/36 ; H01L23/373
Abstract:
A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.
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