Invention Grant
- Patent Title: Electroformed bearing and method of manufacturing same
- Patent Title (中): 电铸轴承及其制造方法
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Application No.: US12678192Application Date: 2008-09-11
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Publication No.: US08469596B2Publication Date: 2013-06-25
- Inventor: Isao Komori , Yasuhiro Yamamoto , Kenji Hibi
- Applicant: Isao Komori , Yasuhiro Yamamoto , Kenji Hibi
- Applicant Address: JP Osaka-shi
- Assignee: NTN Corporation
- Current Assignee: NTN Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-264692 20071010; JP2007-265631 20071011; JP2007-329126 20071220
- International Application: PCT/JP2008/066432 WO 20080911
- International Announcement: WO2009/047963 WO 20090416
- Main IPC: F16C33/02
- IPC: F16C33/02
Abstract:
Fine particles (6) are retained by an electroformed portion (4) in a dispersed state, and the fine particles (6) exposed from an outer peripheral surface (4a2) of the electroformed portion (4) are molten so as to form micro projections (60) integrated with a resin portion (5). The micro projections (60) enters into fine-particle traces (4c) formed in the electroformed portion (4) to exert an anchor effect, to thereby increase a fixation force between the resin portion (5) and the electroformed portion (4).
Public/Granted literature
- US20110216992A1 ELECTROFORMED BEARING AND METHOD OF MANUFACTURING SAME Public/Granted day:2011-09-08
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