Invention Grant
- Patent Title: Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
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Application No.: US13310515Application Date: 2011-12-02
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Publication No.: US08470115B2Publication Date: 2013-06-25
- Inventor: Maiko Tanaka , Michio Uruno , Takayuki Matsuzaki , Ryoji Furutani , Michio Mashino , Teiichi Inada
- Applicant: Maiko Tanaka , Michio Uruno , Takayuki Matsuzaki , Ryoji Furutani , Michio Mashino , Teiichi Inada
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2004-300541 20041014
- Main IPC: B29C65/50
- IPC: B29C65/50 ; B32B37/14 ; B32B38/10 ; B32B38/04

Abstract:
An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.
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