Invention Grant
- Patent Title: Assembly of radiofrequency chips
- Patent Title (中): 组装射频芯片
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Application No.: US12665419Application Date: 2008-06-18
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Publication No.: US08471773B2Publication Date: 2013-06-25
- Inventor: Dominique Vicard , Jean Brun , Benoît Lepine
- Applicant: Dominique Vicard , Jean Brun , Benoît Lepine
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Vedder Price P.C.
- Priority: FR0704445 20070621
- International Application: PCT/FR2008/051079 WO 20080618
- International Announcement: WO2009/004243 WO 20090108
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.
Public/Granted literature
- US20100245182A1 Assembly of Radiofrequency Chips Public/Granted day:2010-09-30
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