Invention Grant
- Patent Title: Camera module facilitating heat dissipation
- Patent Title (中): 相机模块便于散热
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Application No.: US13113943Application Date: 2011-05-23
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Publication No.: US08471948B2Publication Date: 2013-06-25
- Inventor: Sheng-Hung Hou , Wen-Ching Lai
- Applicant: Sheng-Hung Hou , Wen-Ching Lai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100105559A 20110221
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
A camera module includes a printed circuit board (PCB), an image sensor fixed to the PCB, a lens holder fixed to the PCB and covering the image sensor, a lens barrel coupled to the lens holder, and a lens received in the lens barrel. The lens holder includes an inner sensor cover and an outer sensor cover surrounding the inner sensor cover. The image sensor, the inner sensor cover, the lens barrel and the lens define an enclosed space. The inner sensor cover and the outer sensor cover define an intermediate space. The inner sensor cover defines an inner dissipation hole communicating the enclosed space with the intermediate space. The outer sensor cover defines an outer dissipation hole that communicates the intermediate space with the outside of the outer sensor cover. The inner dissipation hole and the outer dissipation hole are misaligned to prevent the ingress of light and dust.
Public/Granted literature
- US20120212664A1 CAMERA MODULE FACILITATING HEAT DISSIPATION Public/Granted day:2012-08-23
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