A method for utilizing fabrication defect of an article includes steps of obtaining a defect image from a fabrication process for fabricating the article, wherein the defect image includes a defect and fabricated circuit patterns around the defect; obtaining coordinates of the defect; retrieving a layout of the article including design circuit patterns; extracting a contour of the defect from the defect image; superposing the contour of the defect on the layout according to the coordinates of the defect; and determining whether the defect causes a open failure or a short failure on the layout by analyzing overlaps between the contour of the defect and the design circuit patterns. Therefore, the article's health can be monitored during the fabrication process, not until the end of the fabrication process.