Invention Grant
- Patent Title: Fast photolithography process simulation to predict remaining resist thickness
- Patent Title (中): 快速光刻工艺模拟预测剩余抗蚀剂厚度
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Application No.: US12723515Application Date: 2010-03-12
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Publication No.: US08473271B2Publication Date: 2013-06-25
- Inventor: Artak Isoyan , Lawrence S. Melvin, III
- Applicant: Artak Isoyan , Lawrence S. Melvin, III
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Fenwick & West LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A lithography model uses a transfer function to map exposure energy dose to the thickness of remaining photoresist after development; while allowing the flexibility to account for other physical processes. In one approach, the model is generated by fitting empirical data. The model may be used in conjunction with an aerial image to obtain a three-dimensional profile of the remaining photoresist thickness after the development process. The lithography model is generally compact, yet capable of taking into account various physical processes associated with the photoresist exposure and/or development process for more accurate simulation.
Public/Granted literature
- US20110224963A1 Fast Photolithography Process Simulation to Predict Remaining Resist Thickness Public/Granted day:2011-09-15
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