Invention Grant
- Patent Title: Power delivery in a heterogeneous 3-D stacked apparatus
- Patent Title (中): 在异种3-D堆叠设备中的功率输送
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Application No.: US13552091Application Date: 2012-07-18
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Publication No.: US08473762B2Publication Date: 2013-06-25
- Inventor: Robert H. Dennard , Eren Kursun
- Applicant: Robert H. Dennard , Eren Kursun
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent William Stock
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F1/26 ; H01L23/02 ; H01L23/52 ; H02J1/10 ; B23K11/24

Abstract:
A heterogeneous three-dimensional (3-D) stacked apparatus is provided that includes multiple layers arranged in a stacked configuration with a lower layer configured to receive a board-level voltage and one or more upper layers stacked above the lower layer. The heterogeneous 3-D stacked apparatus also includes multiple tiles per layer, where each tile is designed to receive a separately regulated voltage. The heterogeneous 3-D stacked apparatus additionally includes at least one layer in the one or more upper layers with voltage converters providing the separately regulated voltage converted from the board-level voltage.
Public/Granted literature
- US20120284541A1 POWER DELIVERY IN A HETEROGENEOUS 3-D STACKED APPARATUS Public/Granted day:2012-11-08
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