Invention Grant
- Patent Title: Thermal sealing packaging systems and methods for thermal sealing packaging
- Patent Title (中): 热封包装系统和热封包装方法
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Application No.: US12847855Application Date: 2010-07-30
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Publication No.: US08474226B2Publication Date: 2013-07-02
- Inventor: Eneko Izquierdo , Takashi Katayama
- Applicant: Eneko Izquierdo , Takashi Katayama
- Applicant Address: ES Onati JP Ohta-Ku, Tokyo
- Assignee: Ulma Packaging Technological Center, S. Coop.,Teraoka Seiko Co., Ltd.
- Current Assignee: Ulma Packaging Technological Center, S. Coop.,Teraoka Seiko Co., Ltd.
- Current Assignee Address: ES Onati JP Ohta-Ku, Tokyo
- Agency: Hamilton, DeSanctis & Cha, LLP
- Agent Tim L. Kitchen; Peter B. Scull
- Priority: JP2009-177852 20090730
- Main IPC: B65B51/10
- IPC: B65B51/10

Abstract:
A thermal seal packaging systems and methods thereof. In one implementation a thermal sealing packaging system has a container transfer unit for transferring a container which is to contain a package item, a measuring unit for measuring the weight of the item that is loaded in the container being transported before it is loaded into the container, a capping film supply unit for a capping film to cover the opening area of the container, an indication means for indicating the measurement data of the measurement unit on the capping film, and a sealing unit for heat-sealing an opening area of the container, into which the package item is loaded, with the capping film, the opening area of the container into which the item is loaded is covered by the capping film on which the corresponding measurement data is indicated.
Public/Granted literature
- US20110023421A1 THERMAL SEALING PACKAGING SYSTEMS AND METHODS FOR THERMAL SEALING PACKAGING Public/Granted day:2011-02-03
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