Invention Grant
- Patent Title: Solderless linking method and structure for jewelry
- Patent Title (中): 无焊接连接方法和结构的首饰
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Application No.: US13115511Application Date: 2011-05-25
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Publication No.: US08474238B2Publication Date: 2013-07-02
- Inventor: Saayli Dhongade
- Applicant: Saayli Dhongade
- Applicant Address: IN Andheri (East), Mumbai
- Assignee: Elegant Collection
- Current Assignee: Elegant Collection
- Current Assignee Address: IN Andheri (East), Mumbai
- Agency: Levisohn Berger LLP
- Main IPC: F16G13/00
- IPC: F16G13/00
Abstract:
A jewelry link assembly and method in which successive links are slipped onto prior links and are held together without the need for soldering between adjacent links. An infinitely hinged connection between adjacent links is formed permitting substantial flexibility when the hinged link bracelet assembly is so constructed.
Public/Granted literature
- US20120297749A1 SOLDERLESS LINKING METHOD AND STRUCTURE FOR JEWELRY Public/Granted day:2012-11-29
Information query
