Invention Grant
- Patent Title: Wireless IC device
- Patent Title (中): 无线IC设备
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Application No.: US12510340Application Date: 2009-07-28
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Publication No.: US08474725B2Publication Date: 2013-07-02
- Inventor: Noboru Kato , Yuya Dokai
- Applicant: Noboru Kato , Yuya Dokai
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-118543 20070427
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A wireless IC device includes a wireless IC chip arranged to process a transmission/received signal, a matching inductance element and a planar electrode which are provided on the surface of a feeder circuit board formed by a flexible dielectric, and a loop-shaped radiation plate provided on the undersurface of the feeder circuit board. Both ends of the radiation plate are coupled to a resonance circuit including an inductance element by electromagnetic field coupling. The wireless IC chip is operated using a signal received by the radiation plate. A response signal transmitted from the wireless IC chip is externally transmitted from the radiation plate.
Public/Granted literature
- US20090277966A1 WIRELESS IC DEVICE Public/Granted day:2009-11-12
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