A method of assembling a pressure sensing module includes affixing a pressure sensor unit to an alignment tool and indexing the alignment tool to a circuit board. After the pressure sensor unit is attached to the circuit board, a seal plate is indexed thereto. A locator feature indexes receptacle elements on the circuit board, alignment tool, and seal plate. An integrated seal module includes a mounting plate having first and second opposing faces, and at least one locator hole and one or more pressure passages extending therethrough. A unitary seal member effects a fluid seal between the pressure ports and the first face and the pressure sources and the second face. A seal member and locator bushings may be formed as a single, continuous liquid injection molded framework, including portions encased by the mounting plate. Pressure passages provide fluid to pressure sensors, which may be overmolded in the mounting plate.