Invention Grant
- Patent Title: Enhanced compound pendulums and systems
- Patent Title (中): 增强复合摆和系统
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Application No.: US12695926Application Date: 2010-01-28
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Publication No.: US08475034B2Publication Date: 2013-07-02
- Inventor: W. Daniel Hillis
- Applicant: W. Daniel Hillis
- Applicant Address: US CA San Francisco
- Assignee: The Long Now Foundation
- Current Assignee: The Long Now Foundation
- Current Assignee Address: US CA San Francisco
- Agency: Glenn Patent Group
- Agent Michael A. Glenn
- Main IPC: G04B17/22
- IPC: G04B17/22

Abstract:
Enhanced compound pendulums provide thermal compensation and/or barometric compensation, such as for a mechanical clock system. The enhanced compound pendulums are simple to construct, and can be more easily compensated than conventional, single-bob pendulums. The enhanced compound pendulums typically comprise material that is added above the point of rotation. Thermal expansion factors for components of the enhanced compound pendulums may preferably be chosen to provide thermal compensation to the first order. In some embodiments of enhanced compound pendulums, volume is added above the pivot to provide barometric compensation, such as by equalizing the moments above and below the pivot, or by providing geometric symmetry above and below the pivot, with a lower density above the pivot.
Public/Granted literature
- US20100128574A1 ENHANCED COMPOUND PENDULUMS AND SYSTEMS Public/Granted day:2010-05-27
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