Invention Grant
- Patent Title: Timepiece face and timepiece
- Patent Title (中): 钟表面和钟表
-
Application No.: US13411954Application Date: 2012-03-05
-
Publication No.: US08475036B2Publication Date: 2013-07-02
- Inventor: Koki Takasawa
- Applicant: Koki Takasawa
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2011-050350 20110308
- Main IPC: G04B37/00
- IPC: G04B37/00

Abstract:
To provide a timepiece face created by bonding a plurality of substrates configured primarily from polycarbonate, excellent bonding strength being achieved between substrates and air bubbles being effectively prevented from forming in the bond layer, and a timepiece including the timepiece face, a timepiece face according to the invention includes a first substrate configured primarily from polycarbonate; a second substrate configured primarily from polycarbonate; and a bond layer for bonding the first substrate and the second substrate.
Public/Granted literature
- US20120230166A1 TIMEPIECE FACE AND TIMEPIECE Public/Granted day:2012-09-13
Information query