Invention Grant
- Patent Title: Injection mold
- Patent Title (中): 注塑模具
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Application No.: US13070621Application Date: 2011-03-24
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Publication No.: US08475156B2Publication Date: 2013-07-02
- Inventor: Wen-Peng Gong , Xiao-Ping Wu , Kun-Hsueh Chiang
- Applicant: Wen-Peng Gong , Xiao-Ping Wu , Kun-Hsueh Chiang
- Applicant Address: TW Taipei
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: B29C45/44
- IPC: B29C45/44

Abstract:
An injection mold for molding a product having a hook portion includes a stationary mold, a return pin, a movable mold, an ejector mechanism and a plurality of ejector pins for ejecting the product out of the injection mold. The movable mold defines an inserting perforation, a receiving groove and a receiving gap. The ejector mechanism includes a slide block located in the receiving groove, a supporting bar stretching into the receiving groove, and an inclined ejector pin having a tail at a top thereof movably inserted in the inserting perforation and fastened on the slide block. The slide block is pressed downward by the return pin when the injection mold is closed. When the injection mold is opened, the slide block drives the inclined ejector pin to move upward and sideward under an upward push of the supporting bar to make the hook portion parted from the tail.
Public/Granted literature
- US20120244238A1 INJECTION MOLD Public/Granted day:2012-09-27
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