Invention Grant
- Patent Title: Electrical connector having improved insulative housing
- Patent Title (中): 具有改进的绝缘壳体的电连接器
-
Application No.: US12972557Application Date: 2010-12-20
-
Publication No.: US08475178B2Publication Date: 2013-07-02
- Inventor: Wei-Chih Lin , Yen-Chih Chang
- Applicant: Wei-Chih Lin , Yen-Chih Chang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: TW98223702U 20091218
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00

Abstract:
An electrical connector includes a substrate, an upper plate, a lower plate, and a number of contacts. The substrate has a number of passageways. The upper plate and the lower plate are mounted upon and below the substrate, respectively. The upper plate and the lower plate both have a number of apertures corresponding to the passageways and a recess to receive the substrate. The contacts are received in the passageways and the apertures.
Public/Granted literature
- US20110151689A1 ELECTRICAL CONNECTOR HAVING IMPROVED INSULATIVE HOUSING Public/Granted day:2011-06-23
Information query