Invention Grant
- Patent Title: Board-to-board connector
- Patent Title (中): 板对板连接器
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Application No.: US13081469Application Date: 2011-04-06
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Publication No.: US08475182B2Publication Date: 2013-07-02
- Inventor: Tsung-Hsi Li , Ming-Chih Hsieh
- Applicant: Tsung-Hsi Li , Ming-Chih Hsieh
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99146259A 20101228
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A board-to-board connector includes a double plastic pin header connector and a supporting plate. The double plastic pin header connector includes two opposite positioning plates, and a number of pin headers arranged in two rows and extending through the positioning plates. The supporting plate is placed between the two rows of pin headers, with opposite ends of the supporting plate resisting against the corresponding positioning plates.
Public/Granted literature
- US20120164853A1 BOARD-TO-BOARD CONNECTOR Public/Granted day:2012-06-28
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