Invention Grant
- Patent Title: Unlubricated bearing structure and IC socket using same
- Patent Title (中): 未润滑轴承结构和IC插座使用相同
-
Application No.: US13226581Application Date: 2011-09-07
-
Publication No.: US08475196B2Publication Date: 2013-07-02
- Inventor: Osamu Hachuda
- Applicant: Osamu Hachuda
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agency: Staas & Halsey LLP
- Priority: JP2010-205082 20100914
- Main IPC: H01R13/62
- IPC: H01R13/62

Abstract:
An unlubricated bearing structure for supporting a rocking arm of an IC socket includes an arm support as an operating member that supports the rocking arm, a support shaft, made of metal, fitted and fixed to the arm support, and a cylindrical bush, made of metal, mounted to the support shaft so that the cylindrical bush is fitted into a bearing hole formed to the rocking arm. The support shaft, the cylindrical bush and the rocking arm are arranged such that a first clearance is formed between an outer peripheral surface of the support shaft and an inner peripheral surface of the cylindrical bush, and a second clearance is formed between an outer peripheral surface of the cylindrical bush and an inner peripheral surface of the bearing hole.
Public/Granted literature
- US20120064756A1 UNLUBRICATED BEARING STRUCTURE AND IC SOCKET USING SAME Public/Granted day:2012-03-15
Information query