Invention Grant
- Patent Title: Polishing pads including sidewalls and related polishing apparatuses
- Patent Title (中): 抛光垫包括侧壁和相关的抛光装置
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Application No.: US12855164Application Date: 2010-08-12
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Publication No.: US08475238B2Publication Date: 2013-07-02
- Inventor: Jae-Kwang Choi , Bo-Un Yoon , Myung-Ki Hong
- Applicant: Jae-Kwang Choi , Bo-Un Yoon , Myung-Ki Hong
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2009-0074849 20090813
- Main IPC: B24D11/00
- IPC: B24D11/00
Abstract:
A polishing pad may include a base and a plurality of polishing protrusions on a surface of the base. Each polishing protrusion may include a sidewall defining an opening in a surface of the polishing protrusion opposite the base. In addition, portions of the sidewall opposite the base may define a contact surface.
Public/Granted literature
- US20110039480A1 Polishing Pads Including Sidewalls and Related Polishing Apparatuses Public/Granted day:2011-02-17
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