- Patent Title: Wafer structure and epitaxial growth method for growing the same
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Application No.: US12382329Application Date: 2009-03-13
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Publication No.: US08475588B2Publication Date: 2013-07-02
- Inventor: Sung-Soo Park
- Applicant: Sung-Soo Park
- Applicant Address: KR Gyeongsangbuk-do
- Assignee: Samsung Corning Precision Materials Co., Ltd.
- Current Assignee: Samsung Corning Precision Materials Co., Ltd.
- Current Assignee Address: KR Gyeongsangbuk-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2005-0001540 20050107
- Main IPC: C30B1/02
- IPC: C30B1/02

Abstract:
A wafer structure and epitaxial growth method for growing the same. The method may include forming a mask layer having nano-sized areas on a wafer, forming a porous layer having nano-sized pores on a surface of the wafer by etching the mask layer and a surface of the wafer, and forming an epitaxial material layer on the porous layer using an epitaxial growth process.
Public/Granted literature
- US20090181525A1 Wafer structure and epitaxial growth method for growing the same Public/Granted day:2009-07-16
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