The invention relates to a process for improving the adhesion of a layer made of a material that is crosslinkable by exposure to UV rays to a substrate, and also to a process for manufacturing a transistor comprising at least one step of performing such a process.This process for improving the adhesion of a layer made of a material M to the surface of a substrate S is characterized in that: the material M is a material that is crosslinkable by exposure to UV rays, and in that it comprises the following steps: a) deposition, on at least one surface of the substrate S, of a nonpolymerized polymerizable composition P, comprising at least one molecule F comprising a first reactive group F1 that is capable of reacting, by exposure to UV rays, with a reactive group M1 of the surface of the material M, and a second reactive group F2 that is capable of forming bonds with the material(s) constituting the surface of the substrate S, b) deposition, onto the layer of the nonpolymerized composition P obtained in step a), of a layer made of a noncrosslinked material M, and c) exposure to UV rays of the three-layer structure obtained in step b). The invention finds application in particular in the field of manufacturing transistors.