Invention Grant
- Patent Title: Substrate liquid processing apparatus, substrate liquid processing method, and storage medium having substrate liquid processing program stored therein
- Patent Title (中): 基板液体处理装置,基板液体处理方法和存储有基板液体处理程序的存储介质
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Application No.: US12902721Application Date: 2010-10-12
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Publication No.: US08475668B2Publication Date: 2013-07-02
- Inventor: Hiroshi Tanaka , Teruomi Minami , Yosuke Kawabuchi , Norihiro Ito , Fumihiro Kamimura , Takashi Yabuta , Kazuki Kosai , Takeshi Uno , Kenji Sekiguchi , Yasushi Fujii
- Applicant: Hiroshi Tanaka , Teruomi Minami , Yosuke Kawabuchi , Norihiro Ito , Fumihiro Kamimura , Takashi Yabuta , Kazuki Kosai , Takeshi Uno , Kenji Sekiguchi , Yasushi Fujii
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2009-239452 20091016; JP2010-180668 20100812
- Main IPC: H01B13/00
- IPC: H01B13/00

Abstract:
Provided are a substrate liquid processing apparatus, a substrate liquid processing method, and a computer readable storage medium having a substrate liquid processing program stored therein that can prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. The substrate liquid processing apparatus processes a circuit-forming surface of the substrate with a chemical liquid. Furthermore, prior to processing the substrate with the chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate by an anti-static liquid, thereby emitting the electric charges on the substrate.
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