Invention Grant
US08475672B2 Plasma processing device, plasma processing method and method of manufacturing element including substrate to be processed
有权
等离子体处理装置,等离子体处理方法以及包括待处理基板的元件的制造方法
- Patent Title: Plasma processing device, plasma processing method and method of manufacturing element including substrate to be processed
- Patent Title (中): 等离子体处理装置,等离子体处理方法以及包括待处理基板的元件的制造方法
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Application No.: US13193856Application Date: 2011-07-29
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Publication No.: US08475672B2Publication Date: 2013-07-02
- Inventor: Kazuyuki Iori , Yukito Nakagawa
- Applicant: Kazuyuki Iori , Yukito Nakagawa
- Applicant Address: JP Kawasaki-shi
- Assignee: Canon Anelva Corporation
- Current Assignee: Canon Anelva Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2009-025852 20090206
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C14/35 ; C23F1/00

Abstract:
The present invention provides a plasma processing device and a plasma processing method that can easily adjust plasma density distribution while making the plasma density uniform, and a method of manufacturing an element including a substrate to be processed. In an embodiment of the present invention, the inside of a vacuum vessel (1) is divided by a grid (4) having communication holes into a plasma generation chamber (2) and a plasma processing chamber (5). On the upper wall (26) of the plasma generation chamber (2), magnetic coils (12) are arranged such that magnetic field lines within the vacuum vessel (1) point from the center of the vacuum vessel (1) to a side wall (27), and, outside the side wall (27) of the plasma generation chamber (2), ring-shaped permanent magnets (13) are arranged such that a polarity pointing to the inside of the vacuum vessel (1) is a north pole and a polarity pointing to the outside of the vacuum vessel (1) is a south pole.
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Information query
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