Invention Grant
- Patent Title: Method for packaging light emitting diode
- Patent Title (中): 封装发光二极管的方法
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Application No.: US12049443Application Date: 2008-03-17
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Publication No.: US08475696B2Publication Date: 2013-07-02
- Inventor: Chih-hsiang Lin , Ya-Lan Chuang , Pei-Jung Tsat , Shu-Ling Yeh , Chin-Lang Wu , Cing-Jiuh Kang , Hsin-Ching Kao
- Applicant: Chih-hsiang Lin , Ya-Lan Chuang , Pei-Jung Tsat , Shu-Ling Yeh , Chin-Lang Wu , Cing-Jiuh Kang , Hsin-Ching Kao
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW96140577A 20071029
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.
Public/Granted literature
- US20090108496A1 METHOD FOR PACKAGING LIGHT EMITTING DIODE Public/Granted day:2009-04-30
Information query
IPC分类:
