A silicone rubber molding, which contains 1-50 wt % of a thermoplastic resin powder and whose silicone rubber surface possesses thermoplasticity and irregularities, and a method for manufacturing a silicone rubber molding, wherein an embossing die having surface irregularities is pressed into the surface of silicone rubber containing 1-50 wt % of a thermoplastic resin powder at a temperature that is not less than the softening point of said thermoplastic resin powder so as to transfer the irregularities of the embossing die thereto.