According to one embodiment, first image information of a mold is acquired by irradiating the mold with first light, the mold having an uneven pattern with a shape corresponding to a pattern to be transferred onto a substrate to be processed. The position of the uneven pattern of the mold is adjusted by applying stress to the mold. Second image information is acquired by irradiating the mold whose position is adjusted with the first light. Stress information of the mold whose position is adjusted is measured by comparing the first image information with the second image information. The position adjustment is repeated until the measurement result satisfies a desired condition, and a pattern is formed on the substrate by using the mold whose position is adjusted.