Invention Grant
- Patent Title: Bone prosthetic material and method of manufacturing the same
- Patent Title (中): 骨修复材料及其制造方法
-
Application No.: US12996303Application Date: 2009-06-05
-
Publication No.: US08475821B2Publication Date: 2013-07-02
- Inventor: Takamasa Saso , Ryuichi Mizutani
- Applicant: Takamasa Saso , Ryuichi Mizutani
- Applicant Address: JP Tokyo
- Assignee: Brain Base Corporation
- Current Assignee: Brain Base Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-147655 20080605
- International Application: PCT/JP2009/060308 WO 20090605
- International Announcement: WO2009/148147 WO 20091210
- Main IPC: A61F2/28
- IPC: A61F2/28 ; A61K33/42 ; A61K33/06 ; C04B35/64

Abstract:
A method of manufacturing a bone prosthetic material, includes by forming tricalcium phosphate (TCP) particle precursor particles; by performing preliminary sintering on the TCP precursor particles at a temperature in a first temperature range to produce TCP particles of diameters in a predetermined diameter range; by granulating the TCP particles to produce granulated bodies; and by performing sintering on the granulated bodies at a temperature in a second temperature range to generate sinter assemblies. The second temperature range is higher than the first temperature range. In the bone prosthetic material manufactured thus, a first space in a range of 100 to 400 μm is formed between adjacent two of a plurality of sintered assemblies. Each of the plurality of sintered assemblies includes tricalcium phosphate (TCP) particles which are subjected to sintering, and a second space in a range of 5 to 100 μm is formed between adjacent two of the TCP particles. The second space communicates with the first space. Each of the plurality of sintered assemblies has a connection portion connecting the TCP particles, and the connection portion has a width in a range of 5 to 20 μm.
Public/Granted literature
- US20110097373A1 BONE PROSTHETIC MATERIAL AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-04-28
Information query
IPC分类: