Invention Grant
- Patent Title: Topical patch for pain relief using cooling agent
- Patent Title (中): 使用冷却剂缓解疼痛的局部贴片
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Application No.: US13312744Application Date: 2011-12-06
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Publication No.: US08475836B2Publication Date: 2013-07-02
- Inventor: Jutaro Shudo
- Applicant: Jutaro Shudo
- Applicant Address: US CA San Jose
- Assignee: Teikoku Pharma USA, Inc.
- Current Assignee: Teikoku Pharma USA, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Bozicevic, Field & Francis, LLP
- Agent Rudy J. Ng; Bret E. Field
- Main IPC: A61F13/02
- IPC: A61F13/02 ; A61F13/00 ; A61L15/16 ; A61K9/70

Abstract:
Topical patch preparations that contain an odorless physiological cooling agent, and methods for using the same are provided. The subject topical patch preparations are made up of an adhesive gel composition that is present on a support, where the adhesive gel composition includes the odorless physiological cooling agent, a water-soluble polymer gel, water and a water holding agent. In using the subject topical patch preparations, the topical patch preparations are applied to a skin surface of a subject and maintained at the site of application for a period of time sufficient for an effective amount of the an odorless physiological cooling agent to be administered to the subject. The subject invention finds use in a variety of applications.
Public/Granted literature
- US20120076850A1 Topical Patch For Pain Relief Using Cooling Agent Public/Granted day:2012-03-29
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