Invention Grant
- Patent Title: Method for forming electrical traces on substrate
- Patent Title (中): 在基板上形成电迹线的方法
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Application No.: US12570040Application Date: 2009-09-30
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Publication No.: US08475867B2Publication Date: 2013-07-02
- Inventor: Yao-Wen Bai , Cheng-Hsien Lin
- Applicant: Yao-Wen Bai , Cheng-Hsien Lin
- Applicant Address: CN Shenzhen TW Tayuan, Taoyuan
- Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW Tayuan, Taoyuan
- Agency: Altis Law Group, Inc.
- Priority: CN200810305777 20081127
- Main IPC: C23C18/54
- IPC: C23C18/54 ; C23C18/38
Abstract:
A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.
Public/Granted literature
- US20100129532A1 METHOD FOR FORMING ELECTRICAL TRACES ON SUBSTRATE Public/Granted day:2010-05-27
Information query
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