Invention Grant
- Patent Title: Device housing and manufacturing method for fabricating the same
- Patent Title (中): 装置壳体及其制造方法
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Application No.: US12603163Application Date: 2009-10-21
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Publication No.: US08475911B2Publication Date: 2013-07-02
- Inventor: Wei Li , Zhong-Cheng Wu , Yan-Zong Yang
- Applicant: Wei Li , Zhong-Cheng Wu , Yan-Zong Yang
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200810305188 20081024
- Main IPC: B32B3/10
- IPC: B32B3/10
Abstract:
A device housing and a manufacturing method for fabricating the device housing are provided. The device housing includes a transparent substrate, a first decorative coating formed on the transparent substrate, a second decorative coating formed on the first decorative coating and the transparent substrate, and a third decorative coating formed on the first decorative coating and the second decorative coating. The first decorative coating has a grid pattern appearance. The second decorative coating is light reflective. The third decorative coating has a color that contrasts against the first decorative coating.
Public/Granted literature
- US20100104833A1 DEVICE HOUSING AND MANUFACTURING METHOD FOR FABRICATING THE SAME Public/Granted day:2010-04-29
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