Invention Grant
US08475976B2 Method of fabricating integrated circuit using alternating phase-shift mask and phase-shift trim mask 有权
使用交变相移掩模和相移修剪掩模制作集成电路的方法

  • Patent Title: Method of fabricating integrated circuit using alternating phase-shift mask and phase-shift trim mask
  • Patent Title (中): 使用交变相移掩模和相移修剪掩模制作集成电路的方法
  • Application No.: US12906861
    Application Date: 2010-10-18
  • Publication No.: US08475976B2
    Publication Date: 2013-07-02
  • Inventor: Thomas J. Aton
  • Applicant: Thomas J. Aton
  • Applicant Address: US TX Dallas
  • Assignee: Texas Instruments Incorporated
  • Current Assignee: Texas Instruments Incorporated
  • Current Assignee Address: US TX Dallas
  • Agent Alan A. R. Cooper; Wade J. Brady, III; Frederick J. Telecky, Jr.
  • Main IPC: G03F1/00
  • IPC: G03F1/00 H01L21/02
Method of fabricating integrated circuit using alternating phase-shift mask and phase-shift trim mask
Abstract:
An integrated circuit is fabricated using photolithography by selectively exposing a photoresist layer to pattern a coarse line region of a wafer layer using a trim mask, and to pattern a fine line region of the wafer layer using an alternating phase-shift mask. The trim mask includes transparent, attenuated phase-shift and opaque regions. The phase-shifted attenuated light region patterns the coarse line region and the opaque region keeps light from exposing the fine line region. The alternating phase-shift mask patterns only the fine line region and includes one or more alternating phase-shift regions that each overlaps at least a portion of the opaque region but does not overlap the attenuated phase-shift region. The alternating phase-shift mask may be used to pattern the trim mask.
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