Invention Grant
- Patent Title: Solid state image pickup device and method for manufacturing solid state image pickup device
- Patent Title (中): 固体摄像装置及固态摄像装置的制造方法
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Application No.: US13029046Application Date: 2011-02-16
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Publication No.: US08476102B2Publication Date: 2013-07-02
- Inventor: Hideaki Takada , Toru Koizumi , Yasuo Yamazaki , Tatsuya Ryoki
- Applicant: Hideaki Takada , Toru Koizumi , Yasuo Yamazaki , Tatsuya Ryoki
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2010-033854 20100218
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a solid state image pickup device including a first active region provided with a first conversion unit, a second active region provided with a second conversion unit, and a third active region adjoining the first and the second active regions with a field region therebetween and being provided with a pixel transistor, the method including the steps of ion-implanting first conductivity type impurity ions to form a semiconductor region serving as a potential barrier against the signal carriers at a predetermined depth in the third active region and ion-implanting second conductivity type impurity ions into the third active region with energy lower than the above-described ion-implantation energy.
Public/Granted literature
- US20110198718A1 SOLID STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID STATE IMAGE PICKUP DEVICE Public/Granted day:2011-08-18
Information query
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