Invention Grant
- Patent Title: Method and apparatus for manufacturing semiconductor device
- Patent Title (中): 用于制造半导体器件的方法和装置
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Application No.: US13343248Application Date: 2012-01-04
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Publication No.: US08476108B2Publication Date: 2013-07-02
- Inventor: Sang Ki Park , Seong Ryong Hwang , Geun Tae Cho
- Applicant: Sang Ki Park , Seong Ryong Hwang , Geun Tae Cho
- Applicant Address: KR
- Assignee: Jusung Engineering Co., Ltd
- Current Assignee: Jusung Engineering Co., Ltd
- Current Assignee Address: KR
- Priority: KR10-2008-0129158 20081218; KR10-2009-0108069 20091110
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/16 ; H01L21/31 ; H01L21/469
Abstract:
A method and apparatus for manufacturing a semiconductor device is disclosed, which is capable of realizing an extension of a cleaning cycle for a processing chamber, the method comprising preheating a substrate; placing the preheated substrate onto a substrate-supporting unit provided in a susceptor while the preheated substrate is maintained at a predetermined height from an upper surface of the susceptor provided in a processing chamber; and forming a thin film on the preheated substrate, wherein a temperature of the preheated substrate is higher than a processing temperature for forming the thin film in the processing chamber.
Public/Granted literature
- US20120100710A1 METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-04-26
Information query
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