Invention Grant
- Patent Title: High performance MOSFET
- Patent Title (中): 高性能MOSFET
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Application No.: US13614476Application Date: 2012-09-13
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Publication No.: US08476139B2Publication Date: 2013-07-02
- Inventor: Huilong Zhu , Jing Wang
- Applicant: Huilong Zhu , Jing Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L27/06 ; H01L21/02

Abstract:
A semiconductor structure which exhibits high device performance and improved short channel effects is provided. In particular, a metal oxide semiconductor field effect transistor (MOFET) is provided that includes a low dopant concentration within an inversion layer of the structure; the inversion layer is an epitaxial semiconductor layer that is formed atop a portion of the semiconductor substrate. The structure also includes a well region of a first conductivity type beneath the inversion layer, wherein the well region has a central portion and two horizontally abutting end portions. The central portion has a higher concentration of a first conductivity type dopant than the two horizontally abutting end portions.
Public/Granted literature
- US20130011981A1 HIGH PERFORMANCE MOSFET Public/Granted day:2013-01-10
Information query
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