Invention Grant
- Patent Title: Styrene-modified polyethylene-based resin beads, styrene-modified polyethylene-based expandable resin beads, production method therefor, pre-expanded beads and expanded molded article
- Patent Title (中): 苯乙烯改性聚乙烯系树脂珠,苯乙烯改性聚乙烯系发泡树脂珠,其制造方法,预发泡珠和发泡成型品
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Application No.: US11659469Application Date: 2005-08-19
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Publication No.: US08476325B2Publication Date: 2013-07-02
- Inventor: Hideyasu Matsumura , Tatsuya Matsugashita
- Applicant: Hideyasu Matsumura , Tatsuya Matsugashita
- Applicant Address: JP Osaka
- Assignee: Sekisui Plastics Co., Ltd.
- Current Assignee: Sekisui Plastics Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2004-257154 20040903
- International Application: PCT/JP2005/015151 WO 20050819
- International Announcement: WO2006/027943 WO 20060316
- Main IPC: C08J9/16
- IPC: C08J9/16 ; C08J9/18 ; B22C1/22 ; B29C44/34

Abstract:
A method for producing styrene-modified polyethylene-based resin beads, including the steps of: dispersing 100 parts by weight of polyethylene-based resin beads which contain an inorganic nucleating agent and have a melting point of 95° C. to 115° C., 20 parts by weight or more and less than 300 parts by weight of a styrene-based monomer and a polymerization initiator into an aqueous suspension containing a dispersant; impregnating the polyethylene-based resin beads with the styrene-based monomer under heating the resulting dispersion at such a temperature that the styrene-based monomer does not substantially polymerize; and performing polymerization of the styrene-based monomer at a temperature of (T)° C. to (T+25)° C. (where T° C. is a melting point of the polyethylene-based resin beads.)
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