Invention Grant
- Patent Title: Resist pattern thickening material, semiconductor device, and production method thereof
- Patent Title (中): 抗蚀图案增厚材料，半导体器件及其制造方法
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Application No.: US12713876Application Date: 2010-02-26
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Publication No.: US08476346B2Publication Date: 2013-07-02
- Inventor: Miwa Kozawa , Koji Nozaki
- Applicant: Miwa Kozawa , Koji Nozaki
- Applicant Address: JP Kawasaki-shi
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-252800 20091104
- Main IPC: C08K5/15
- IPC: C08K5/15
Abstract:
A resist pattern thickening material containing a resin, a cyclic compound expressed by the general formula 1, at least one of compounds expressed by the general formulae 2 to 3, respectively, and water:
Public/Granted literature
- US20110101508A1 RESIST PATTERN THICKENING MATERIAL, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF Public/Granted day:2011-05-05
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