Invention Grant
US08476347B1 Resin compound, resin composition, and resin-molded article 有权
树脂组合物,树脂组合物和树脂模制品

  • Patent Title: Resin compound, resin composition, and resin-molded article
  • Patent Title (中): 树脂组合物,树脂组合物和树脂模制品
  • Application No.: US13485087
    Application Date: 2012-05-31
  • Publication No.: US08476347B1
    Publication Date: 2013-07-02
  • Inventor: Kenji Yao
  • Applicant: Kenji Yao
  • Applicant Address: JP Tokyo
  • Assignee: Fuji Xerox Co., Ltd.
  • Current Assignee: Fuji Xerox Co., Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC.
  • Priority: JP2011-282872 20111226
  • Main IPC: C08K5/523
  • IPC: C08K5/523
Resin compound, resin composition, and resin-molded article
Abstract:
A resin compound includes a reaction product of (A) polymer which is at least selected from aliphatic polyester and aliphatic polyamide and (B) an aromatic compound with a compositional ratio from 0.1 to 10 parts by weight with respect to 100 parts by weight of (A) and represented by the following Formula (1): wherein each of R1, R2, and R3 represents a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, or a substituted or unsubstituted aromatic group having 6 to 10 carbon atoms; each of R4, R5, R6, and R7 represents a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 10 carbon atoms; each dm and n independently represents an integer from 0 to 3; and each of p and q represents an integer from 0 to 4.
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