Invention Grant
- Patent Title: Resin compound, resin composition, and resin-molded article
- Patent Title (中): 树脂组合物,树脂组合物和树脂模制品
-
Application No.: US13485087Application Date: 2012-05-31
-
Publication No.: US08476347B1Publication Date: 2013-07-02
- Inventor: Kenji Yao
- Applicant: Kenji Yao
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC.
- Priority: JP2011-282872 20111226
- Main IPC: C08K5/523
- IPC: C08K5/523

Abstract:
A resin compound includes a reaction product of (A) polymer which is at least selected from aliphatic polyester and aliphatic polyamide and (B) an aromatic compound with a compositional ratio from 0.1 to 10 parts by weight with respect to 100 parts by weight of (A) and represented by the following Formula (1): wherein each of R1, R2, and R3 represents a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, or a substituted or unsubstituted aromatic group having 6 to 10 carbon atoms; each of R4, R5, R6, and R7 represents a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 10 carbon atoms; each dm and n independently represents an integer from 0 to 3; and each of p and q represents an integer from 0 to 4.
Public/Granted literature
- US20130165565A1 RESIN COMPOUND, RESIN COMPOSITION, AND RESIN-MOLDED ARTICLE Public/Granted day:2013-06-27
Information query