Invention Grant
- Patent Title: Amorphous polyamide resin composition and molded product
- Patent Title (中): 无定形聚酰胺树脂组合物和模制产品
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Application No.: US12284835Application Date: 2008-09-25
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Publication No.: US08476353B2Publication Date: 2013-07-02
- Inventor: Hideyuki Higashiyama , Keiji Sekine
- Applicant: Hideyuki Higashiyama , Keiji Sekine
- Applicant Address: JP Tokyo
- Assignee: Asahi Fiber Glass Company, Limited
- Current Assignee: Asahi Fiber Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Holtz Holtz Goodman & Chick PC
- Main IPC: C08K3/34
- IPC: C08K3/34 ; C08K3/40 ; C03C3/078 ; C03C3/087 ; C03C3/093

Abstract:
Provided are an amorphous polyamide resin composition having high transparency, and is excellent in heat resistance and stiffness, and a molded product thereof. The glass filler contains, expressed in terms of oxides by mass %, 68 to 74% of silicon dioxide (SiO2), 2 to 5% of aluminum oxide (Al2O3), 2 to 5% of boron oxide (B2O3), 2 to 10% of calcium oxide (CaO), 0 to 5% of zinc oxide (ZnO), 0 to 5% of strontium oxide (SrO), 0 to 1% of barium oxide (BaO), 1 to 5% of magnesium oxide (MgO), 0 to 5% of lithium oxide (Li2O), 5 to 12% of sodium oxide (Na2O), and 0 to 10% of potassium oxide (K2O), where a total amount of lithium oxide (Li2O), sodium oxide (Na2O), and potassium oxide (K2O) is 8 to 12%.
Public/Granted literature
- US20100076155A1 Amorphous polyamide resin composition and molded product Public/Granted day:2010-03-25
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