A polyolefin based hot melt adhesive composition having improved heat resistance includes a blend of about 5% to 50% by weight of a glassy semicrystalline poly-alpha-olefin polymer, about 5% to 70% by weight of a soft or rubbery polymer, about 5% to 65% by weight of a tackifier, about 0% to 3% by weight of a stabilizer and optionally a wax and/or plasticizer. The composition can also contain other additives and fillers to further modify its properties. An application process for the adhesive composition and various articles assembled therewith are also disclosed. The composition is particularly suited for applications where complicated bonding needs exist that involve bonding of multiple components or parts fabricated from dissimilar materials ranging from steel to plastic to fabrics.