Invention Grant
- Patent Title: Low-k dielectrics obtainable by twin polymerization
- Patent Title (中): 通过双聚合可获得的低k电介质
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Application No.: US12989665Application Date: 2009-04-28
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Publication No.: US08476368B2Publication Date: 2013-07-02
- Inventor: Andreas Klipp , Arno Lange , Hans-Joachim Haehnle
- Applicant: Andreas Klipp , Arno Lange , Hans-Joachim Haehnle
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: EP08155304 20080428
- International Application: PCT/EP2009/055092 WO 20090428
- International Announcement: WO2009/133082 WO 20091105
- Main IPC: C08G73/02
- IPC: C08G73/02

Abstract:
The invention relates to a dielectric layer with a permittivity of 3.5 or less comprising a dielectric obtainable by polymerizing at least one twin monomer comprising a) a first monomer unit which comprises a metal or semimetal, and b) a second monomer unit which is connected to the first monomer unit via a chemical bond, wherein the polymerization involves polymerizing the twin monomer with breakage of the chemical bond and formation of a first polymer comprising the first monomer unit and of a second polymer comprising the second monomer unit, and wherein the first and the second monomer unit polymerize via a common mechanism.
Public/Granted literature
- US20110046314A1 LOW-K DIELECTRICS OBTAINABLE BY TWIN POLYMERIZATION Public/Granted day:2011-02-24
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