A method of bonding dissimilar metals, a bonding structure formed by such a method and a bonding apparatus for performing such a method. The resulting bond is capable of preventing corrosion (e.g., electric corrosion) resulting from contact of the dissimilar metals and obtains a dissimilar material joint exhibiting anti-corrosive property and bonding strength at low costs. The method includes overlapping two materials made from dissimilar metals having a seal material interposed therebetween and discharging the seal material from a bonding interface and bonding the two materials in direct contact with each other.