Invention Grant
- Patent Title: Memory device and fabrication process thereof
- Patent Title (中): 存储器件及其制造工艺
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Application No.: US12906214Application Date: 2010-10-18
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Publication No.: US08476614B2Publication Date: 2013-07-02
- Inventor: Jun Sumino , Shuichiro Yasuda
- Applicant: Jun Sumino , Shuichiro Yasuda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2009-245597 20091026
- Main IPC: H01L47/00
- IPC: H01L47/00

Abstract:
A memory device that includes a resistive-change memory element, the memory device includes: a first memory element that includes a first resistive-change layer and a first electrode connected to the first resistive-change layer; and a second memory element that includes a second resistive-change layer and a second electrode connected to the second resistive-change layer, wherein at least one of the thickness and the material of the second resistive-change layer and the area of the second electrode in contact with the second resistive-change layer is different from the corresponding one of the thickness and the material of the first resistive-change layer and the area of the first electrode in contact with the first resistive-change layer.
Public/Granted literature
- US20110095255A1 MEMORY DEVICE AND FABRICATION PROCESS THEREOF Public/Granted day:2011-04-28
Information query
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