Invention Grant
- Patent Title: LED thermal management
- Patent Title (中): LED热管理
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Application No.: US12945052Application Date: 2010-11-12
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Publication No.: US08476645B2Publication Date: 2013-07-02
- Inventor: Gary A. McDaniel , Chip Akins
- Applicant: Gary A. McDaniel , Chip Akins
- Applicant Address: US CA San Jose
- Assignee: Uni-Light LLC
- Current Assignee: Uni-Light LLC
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L33/00

Abstract:
Thermal management solutions for higher power LEDs. In accordance with embodiments, a heat sink, preferably copper, is connected directly to the thermal pad of an LED. Directly connecting the LED thermal pad to the copper heat sink reduces the thermal resistance between the LED package and the heat sink, and more efficiently conducts heat away from the LED through the copper heat sink. In embodiments, the copper heat sink is directly soldered to the LED thermal pad.
Public/Granted literature
- US20110278629A1 LED THERMAL MANAGEMENT Public/Granted day:2011-11-17
Information query
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