Invention Grant
- Patent Title: Light emitting diode package having multiple luminescent conversion layers
- Patent Title (中): 具有多个发光转换层的发光二极管封装
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Application No.: US13288038Application Date: 2011-11-03
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Publication No.: US08476664B2Publication Date: 2013-07-02
- Inventor: Hsin-Chiang Lin , Wen-Liang Tseng , Chieh-Ling Chang
- Applicant: Hsin-Chiang Lin , Wen-Liang Tseng , Chieh-Ling Chang
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201110061308 20110315
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15
Abstract:
A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.
Public/Granted literature
- US20120235192A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2012-09-20
Information query
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