Invention Grant
US08476720B2 Systems and methods for vertically stacking a sensor on an integrated circuit chip
有权
在集成电路芯片上垂直堆叠传感器的系统和方法
- Patent Title: Systems and methods for vertically stacking a sensor on an integrated circuit chip
- Patent Title (中): 在集成电路芯片上垂直堆叠传感器的系统和方法
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Application No.: US13172604Application Date: 2011-06-29
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Publication No.: US08476720B2Publication Date: 2013-07-02
- Inventor: Chia-Ming Liu
- Applicant: Chia-Ming Liu
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Lowe Graham Jones PLLC
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip, and a micromachined sensor formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound is located between the MEMS die and the Analog ASIC chip. One or more solder balls electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board.
Public/Granted literature
- US20130001709A1 SYSTEMS AND METHODS FOR VERTICALLY STACKING A SENSOR ON AN INTEGRATED CIRCUIT CHIP Public/Granted day:2013-01-03
Information query
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