A prober unit in which probes are brought into contact with to-be-tested semiconductor chips to establish electrical connection between the semiconductor chips and a test unit via the probes. A probe assembly and a plurality of wiring boards are prepared, the probe assembly being constituted by integrated regularly-arranged multiple probe groups including output terminals connected directly to the probes, and each of the wiring boards including wiring adhering to a surface of a non-conductive film; and an n-th row of an output terminal group of the probe assembly is brought into contact with a land group provided at an end of an n-th wiring board, and a wiring terminal provided at the other end of the n-th wiring board is connected to one of a wiring board of the test unit and a connector to establish electrical connection between the to-be-tested semiconductor chips and the test unit.