Invention Grant
- Patent Title: Integrated lens and chip assembly for a digital camera
- Patent Title (中): 用于数码相机的集成镜头和芯片组合
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Application No.: US12930822Application Date: 2011-01-18
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Publication No.: US08477239B2Publication Date: 2013-07-02
- Inventor: Vidyadhar Sitaram Kale , Samuel Waising Tam , Dongkai Shangguan
- Applicant: Vidyadhar Sitaram Kale , Samuel Waising Tam , Dongkai Shangguan
- Applicant Address: US CA San Jose
- Assignee: DigitalOptics Corporation
- Current Assignee: DigitalOptics Corporation
- Current Assignee Address: US CA San Jose
- Agency: Henneman & Associates, PLC
- Agent Larry E. Henneman, Jr.; Gregory P. Gibson
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L23/02 ; H01L21/00
Abstract:
A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).
Public/Granted literature
- US20110115974A1 Integrated lens and chip assembly for a digital camera Public/Granted day:2011-05-19
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