Invention Grant
- Patent Title: Optimizing a seam for a print job
- Patent Title (中): 优化打印作业的接缝
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Application No.: US12764160Application Date: 2010-04-21
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Publication No.: US08477380B2Publication Date: 2013-07-02
- Inventor: Yoav Telem , Shay Dardikman
- Applicant: Yoav Telem , Shay Dardikman
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Nelson Adrian Biish
- Main IPC: H04N1/40
- IPC: H04N1/40
Abstract:
A method for seam for a layout of a packaging printing job (908). The method is adapted to create minimal plate waste (1312) and includes the following steps; providing a wrapped layout (120) comprised of plurality of step and repeat element elements, and analyzing the wrapped layout to produce seam cut line design (1204) for the packaging printing job. The cut line is produced by searching for an non imaged areas inside the images and the borders of the step and repeat elements.
Public/Granted literature
- US20110261414A1 OPTIMIZING A SEAM FOR A PRINT JOB Public/Granted day:2011-10-27
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